A circuit board manufacturing apparatus

摘要

The apparatus (1) has a solder printing station (2) at which solder paste is applied through a screen printing stencil in a desired pattern on to a circuit board. A scanning station (10) downstream of the soldering station (2) is operable to determine the volume of solder paste deposited at selected locations on the circuit board. A component machine (25) has means to pick and place a plurality of components at associated solder paste deposits on the circuit board. A re-flow oven (27) has means for heating and circulating air in a controller manner in a number of heating zones and delivering circuit boards at desired speed through the heating zones to affect solder joints between the components and the circuit board. A wave soldering machine (28) is provided for attachment of components such as connectors which have conductor leads which pass through associated holes in the printed circuit board.