| 摘要 |
PROBLEM TO BE SOLVED: To enhance the productivity by effectively performing chamfering and lapping in the semiconductor wafer manufacturing process. SOLUTION: A semiconductor wafer W as object to be processed is held on a chuck table 14 of a grinding device in such a way that their centers are positioned in alignment, and the chuck table 14 is rotated and the forefront of a rotary blade 20 in high speed rotation is put in light contacting with the center of the semiconductor wafer W, and in this condition, a lapping process is conducted by allowing further the rotary blade 20 to make parallel displacement to near the periphery of the wafer W. Then a chamfering process is conducted by lowering the rotary blade 20 gradually and allowing it to make movement from near the periphery to the outermost peripheral part. This cycle of processing is executed for the obverse and reverse surfaces of the wafer W. |
