| 摘要 |
PROBLEM TO BE SOLVED: To improve polishing uniformity of a semiconductor wafer and flatness of an abrasive pad, by joining first and second support structures respectively having first and second main surfaces through a wave form spring. SOLUTION: A fixing plate 52 that is fixed by a screw 50 having a shoulder and uses a pad conditioner coupling 58 as torque rigidity and a floating plate 55 mutually freely move and mutually take non-same plate attitudes in relation to the vertical direction. A slightly sine-wave-formed wave form spring 54 that is placed between the fixing plate 52 and the floating plate 55 and abuts to the fixing plate 52 and the floating plate 55, when lifting down the pad conditioner coupling 58, non-uniformly compresses a second main surface of the fixing plate 52 in non-parallel with a surface of a polishing medium, and maintains same surface property between a frictional surface of an end effecter 57 and the surface of the polishing medium. In addition, the wave form spring 54 allows a sufficient downward force to be added to the pad conditioner coupling 58. |
