发明名称 EPOXY RESIN COMPOSITION AND DEVICE FOR SEALING SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin composition capable of being highly charged without deteriorating flowability, giving improved interfacial strengths between organic components and inorganic components, and excellent in moisture resistance, or the like, by compounding an epoxy compound, a phenolic compound, a specific titanate- based coupling agent, alumina powder and a curing accelerator. SOLUTION: This epoxy resin composition comprises (A) a solid epoxy compound having two or more epoxy groups in the molecule, (B) a solid phenolic compound having two or more phenolic hydroxyl groups in the molecule, (C) a titanate-based coupling agent of the formula [R1, R2 are each an alkyl; (x), (y) are each an integer of >=1, provided that (x)+(y) = 4] (D) alumina powder having the maximum particle diameter of <100μm and an average particle diameter of <=60μm, and (E) a curing accelerator as essential components. Therein, the component D is contained in an amount of 25-90 wt.% based on the total amount of the resin composition. In the epoxy resin composition, the components C and E are preferably contained in amounts of 0.01-5 wt.% and 0.01-5 wt.%, respectively, based on the total amount of the resin composition.
申请公布号 JP2000191749(A) 申请公布日期 2000.07.11
申请号 JP19980372361 申请日期 1998.12.28
申请人 TOSHIBA CHEM CORP 发明人 ASAMI KENJI;UCHIKAWA TETSUO
分类号 C08K3/22;C08G59/62;C08K5/56;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08G59/62 主分类号 C08K3/22
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