发明名称 Led device
摘要 An LED device includes at least one LED chip having a front contact metallization disposed on a light exit surface of a light-emitting member and a rear contact metallization disposed on a side of the light-emitting member opposite the light exit surface. The LED chip is disposed between first and second conductor track supports. The first conductor track support is transparent and has at least one first electric conductor contacting the front contact metallization. The second conductor track support has at least one second electric conductor contacting the rear contact metallization. The LED device has, inter alia, the special advantage of permitting the size of the LED chips to be reduced, in contrast with the chip size in conventional LED devices, thus allowing the luminous spot density to be increased.
申请公布号 US6087680(A) 申请公布日期 2000.07.11
申请号 US19980127529 申请日期 1998.07.31
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 GRAMANN, WOLFGANG;SPAETH, WERNER;WAITL, GUENTHER;BRUNNER, HERBERT
分类号 H01L25/075;H01L27/15;H01L33/40;(IPC1-7):H01L33/00;G09G3/32 主分类号 H01L25/075
代理机构 代理人
主权项
地址