发明名称 Gate having a barrier of titanium silicide
摘要 A method of fabricating a gate having a barrier layer of titanium silicide is comprised of the steps of forming a layer of gate oxide. The gate oxide may be formed using a standard LOCOS process. A layer of doped polysilicon is deposited over the layer of gate oxide. A layer of titanium silicide is formed in a predetermined relationship with respect the layer of doped polysilicon, i.e., it may be deposited on top of the polysilicon or formed in a top surface of the polysilicon layer. A layer of tungsten silicide is deposited on top of the layer of titanium silicide. The layers of gate oxide, doped polysilicon, titanium silicide, and tungsten silicide are etched to form the gate. A gate thus fabricated is also disclosed.
申请公布号 US6087700(A) 申请公布日期 2000.07.11
申请号 US19980021729 申请日期 1998.02.11
申请人 MICRON TECHNOLOGY, INC. 发明人 FAZAN, PIERRE C.;CHAN, HIANG C.
分类号 H01L21/28;H01L29/49;(IPC1-7):H01L21/76 主分类号 H01L21/28
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