发明名称 POLISHING METHOD AND DEVICE, SETTING METHOD USED FOR THEM AND POLISHER
摘要 PROBLEM TO BE SOLVED: To improve polishing performance, and to intend long period stability and improvement in productivity. SOLUTION: By backing up a polishing pad 9 by a plane surface 19c formed by a nondeforming part 19b which is provided at the swelling part 19a of a backup member 19, and not deformed by the above fluid pressure, and polishing by squeezing it to a work 1, and by squeezing the polishing surface 9a of the polishing pad 9, and a dressing member 41, in the condition holding the backup member 19 to back up by holding the polishing pad 9 to the surface, sucked and supported to a receiver member at the rear part, by sucking from the inner side of a polisher 18, the polishing surface 9a is groud.
申请公布号 JP2000190204(A) 申请公布日期 2000.07.11
申请号 JP19980371927 申请日期 1998.12.28
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OTSUKA KYO;MASAKI TAKESHI;SHINGU KATSUKI
分类号 B24B53/00;B24B1/00;B24B37/005;B24B53/017;B24B53/02;H01L21/304 主分类号 B24B53/00
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