发明名称 Electronic apparatus with improved heatsink arrangement
摘要 Electronic apparatus comprises an electronic component which in use generates heat and a heatsink mounted within a housing having a thermal path to the electronic component. The heatsink comprises formations for generating by natural convection a cooling airflow for dissipating heat from the electronic component. Neighbouring first and second walls of the housing each comprise a vent structure and the formations of the heatsink define one or more oblique paths from the vent structure in the first wall across the heatsink to the vent structure in the second wall so that in at least a first operating orientation the cooling airflow generated by the heatsink passes from the vent structure in the first wall across the heatsink to the vent structure of the second wall and in at least a second operating orientation the cooling airflow generated by the heatsink passes from the vent structure in the second wall across the heatsink to the vent structure of the first wall. The invention finds particular, though not exclusive, application to personal computers which may be operated in either a desktop or tower configuration.
申请公布号 US6088223(A) 申请公布日期 2000.07.11
申请号 US19980156218 申请日期 1998.09.18
申请人 HEWLETT-PACKARD COMPANY 发明人 DIEMUNSCH, GUY
分类号 G06F1/20;(IPC1-7):H05H7/20 主分类号 G06F1/20
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