发明名称 Semiconductor memory device and fabrication method thereof
摘要 A capacitor lower electrode is formed so as to be connected to a main surface of a silicon substrate. The capacitor lower electrode includes a plug portion, a bottom wall portion, and a vertical wall portion. An insulation layer for suppressing crystallization of the vertical wall portion is formed between the bottom wall portion and the vertical wall portion. A capacitor upper electrode is formed on the capacitor lower electrode with a capacitor dielectric layer therebetween.
申请公布号 US6087694(A) 申请公布日期 2000.07.11
申请号 US19980092054 申请日期 1998.06.05
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 OHNO, YOSHIKAZU;INABA, YUTAKA;TSUCHIMOTO, JUNICHI
分类号 H01L21/02;H01L21/8242;H01L27/108;(IPC1-7):H01L27/108 主分类号 H01L21/02
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