发明名称 |
Semiconductor memory device and fabrication method thereof |
摘要 |
A capacitor lower electrode is formed so as to be connected to a main surface of a silicon substrate. The capacitor lower electrode includes a plug portion, a bottom wall portion, and a vertical wall portion. An insulation layer for suppressing crystallization of the vertical wall portion is formed between the bottom wall portion and the vertical wall portion. A capacitor upper electrode is formed on the capacitor lower electrode with a capacitor dielectric layer therebetween.
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申请公布号 |
US6087694(A) |
申请公布日期 |
2000.07.11 |
申请号 |
US19980092054 |
申请日期 |
1998.06.05 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
OHNO, YOSHIKAZU;INABA, YUTAKA;TSUCHIMOTO, JUNICHI |
分类号 |
H01L21/02;H01L21/8242;H01L27/108;(IPC1-7):H01L27/108 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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