| 摘要 |
PROBLEM TO BE SOLVED: To reduce a loss of solder deposited to an oxide by removing an oxide floated in a molten solder without environmental pollution simply, easily, and automatically. SOLUTION: This soldering device 20 is equipped with a solder waved face forming means for forming the solder waved face, a sifter container 10 for spraying a separating agent 8 comprising one chosen from rice bran, grains or powder of cereals, powder of beans, grains or powder of seeds, powder of soybean refuse and powder of peanut shells, or their combination, a container 9 for dipping up an oxide 7, and an exhausting means for reversely turning the container 9 and exhausting the oxide 7.
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