Surface acoustic wave

摘要

A surface acoustic wave device substantially eliminates a stress caused by a curing shrinkage of an adhesive and substantially eliminates a strain in a case containing a surface acoustic wave element to prevent variation in characteristics of the surface acoustic wave device. In addition, a strength of joining of bonding wires provided in the surface acoustic wave device is improved to have an improved reliability. The surface acoustic wave element of the surface acoustic wave device is fixed on a case member via a soft adhesive and bonding electrodes of the surface acoustic wave element have a plurality of through holes. Ends of the bonding wires are wire-bonded to the bonding electrodes having the through holes formed therein.