发明名称 Wire shield structure and method of shielding a wire
摘要 A wire shielding method which achieves electromagnetic shielding and reduces the number of component parts so as to enhance the efficiency of an assembling operation. In the wire shield structure, wires are covered with a shield member formed by laminating a metal foil layer and insulating layer together. The wires are led out of the shield member and connected to desired equipment. An extension portion of the shield member is folded, with the metal foil layer disposed at the inner side to form a lead wire portion. A distal portion of the lead wire portion is folded back with the metal foil layer exposed to form an earth terminal for grounding purposes. Therefore, without the use of a separate lead wire, the shielding effect can be enhanced and the number of component parts can be reduced.
申请公布号 US6085416(A) 申请公布日期 2000.07.11
申请号 US19980177372 申请日期 1998.10.23
申请人 YAZAKI CORPORATION 发明人 IKEDA, TOMOHIRO
分类号 B60R16/02;H01B7/17;H01B11/10;H02G3/04;H05K9/00;(IPC1-7):H01B13/20;H01B11/06;H02G15/02 主分类号 B60R16/02
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