| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance the productivity of a film applied substrate by dispensing with a pressure means large in heat capacity or the heating and cooling process of the substrate. SOLUTION: When a film is bonded, only a film 1 small in heat capacity is heated by the heater 21 provided in the feed route of the film 1 after a cover film 4 is peeled without heating a substrate 12 large in heat capacity and a laminating roll 22 and the film 1 after heating is bonded to the surface of the substrate 12 held to room temp. under pressure by the laminating roll 2 held to a room temp. state. At this time, the heater 21 is controlled so that heating temp. becomes temp. capable of softening the resin layer 3 of the film 1.</p> |
