| 摘要 |
PROBLEM TO BE SOLVED: To prevent change of resistivity by lowering Cu ion concentration contained in a polishing abrasive liquid by interposing an electrode chamber having plural opposite electrode plates for depositing Cu ions in the midway of a feed pipe between a mirror finished surface polishing device and an abrasive liquid tank. SOLUTION: An electrode chamber 27 is disposed in the midway of a feed pipe 24 between a mirror finished surface polishing device 1 and an abrasive liquid tank 2. Two opposite electrode plates 28 are arranged in the electrode chamber 27, and a power supply 29 is connected to the electrode plates 28. Voltage set to a suitable value is applied between two electrode plates 28 to carry current, thereby depositing Cu ions in the polishing abrasive liquid 4 on the electrode plates 28, whereby the polishing abrasive liquid 4 decreased in Cu ion concentration is fed to the mirror finished surface polishing device 1. Thus, the polishing abrasive liquid 4 is circulated to be used, so that the Cu ion concentration in the polishing abrasive liquid 4 will not be heightened.
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