发明名称 |
Solid state silicon-based condenser microphone |
摘要 |
A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.
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申请公布号 |
US6088463(A) |
申请公布日期 |
2000.07.11 |
申请号 |
US19980182668 |
申请日期 |
1998.10.30 |
申请人 |
MICROTRONIC A/S |
发明人 |
ROMBACH, PIRMIN;MULLENBORN, MATTHIAS;HANSEN, OLE;HESCHEL, MATTHIAS;BOUWSTRA, SIEBE;AMSKOV GRAVAD, MAJA;HVIMS, HENRIK LAURIDS |
分类号 |
H04R19/00;(IPC1-7):H04R25/00 |
主分类号 |
H04R19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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