| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a semiconductor device that can effectively dissipate the heat generated from the device by filling carbon fibers coated with a ferromagnetic substance on their surfaces with an adhesive polymer and intervening the thermally conductive adhesive between the substrates so that the carbon fibers are oriented in a certain direction. SOLUTION: Carbon fibers having an average diameter of 5-20μ, an average length of 20-800μm and a thermal conductivity of >=200 W/mk in the fiber- length direction are coated with at least one ferromagnetic particles selected from nickel, iron, ferrite, chromium, cobalt, manganese or rare earth in a layer thickness of 0.01-5μm, and filled with at least one of adhesive polymer selected from the group consisting of epoxy, polyimide, acryl, urethane, vinyl and silicone polymers to prepare the objective thermally conductive adhesive. The resultant adhesive (3) is intervened between the semiconductor chips 8 and the substrates such as die pads 7 or the like, thus the carbon fibers are oriented in a certain direction by action of the external magnetic field and adhered.</p> |
