| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polishing method and a polishing device which can realize a polishing with an even polishing amount and a good flatness, by preventing the uneven distribution of a polishing liquid on a polished surface, when the polishing is carried out by using a polishing liquid. SOLUTION: When the polishing is carried out by an abrasive material 2 such as a grinding wheel, by feeding a polishing liquid 3 to the polished surface of a polished material 1 such as a wafer, the polishing is carried out by making even the distribution of the polishing liquid on the polished surface by an air blasting. In this polishing device to polish by a polishing material by feeding the polishing liquid to the polished surface of the polished material, an air blasting means 7 (a blower tube) to make the distribution of the polishing liquid on the polished surface even, is provided.</p> |
