CURABLE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To obtain a curable resin composition good in formation of resist films and excellent in sensitivity to a solder resist ink. SOLUTION: This curable resin composition uses a modified copolymer prepared by adding an epoxy group-containing unsaturated compound to a part of acid groups in a copolymer comprising acrylic acid and an acrylic or a methacrylic ester as main comonomer components. The curable resin composition further uses a compound having an unsaturated group and at least one acid group except acrylic acid in place of a part of the acrylic acid. Furthermore, the epoxy group-containing unsaturated compound is an alicyclic epoxy group-containing compound and the alicyclic epoxy group-containing unsaturated compound is 3,4-cyclohexylmethyl (meth)acrylate.