发明名称 MOLDING METHOD AND PLATED PRODUCT BY PLATING SUCH MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a reinforced thermoplastic resin having an excellent production efficiency by obtaining a plated product having excellent plating appearance, high temperature characteristics and excellent plating film adhesive properties. SOLUTION: The method for molding a reinforced thermoplastic resin comprises the step of bringing a reinforced thermoplastic resin composition obtained by blending 100 pts.wt. of a total resin composition containing 15 to 70 wt.% of a component A, and 30 to 85 pts.wt. of a component B further with 1 to 150 pts.wt. of an inorganic filler (component C) into contact with a surface of a mold cavity of a specific temperature range (high temperature). Here, the component A is a copolymer obtained by polymerizing at least one type of monomer selected from a (A-1) diene monomer and (A-2) aromatic vinyl compound, a vinyl cyanide compound, an acrylate compound, and a methacrylate compound, and the component B is an amorphous thermoplastic resin except the component A.
申请公布号 JP2000190328(A) 申请公布日期 2000.07.11
申请号 JP19980373370 申请日期 1998.12.28
申请人 TEIJIN CHEM LTD 发明人 KIZAWA HIROMITSU;HOTAKA TOSHIMASA
分类号 C08J7/00;B29C33/02;B29C45/26;B29C45/73;C08K3/00;C08L9/00;C08L25/00;C08L33/08;C08L33/10;C08L67/03;C08L69/00;C08L71/12;C23C18/16;C23C28/00;C23C28/02;(IPC1-7):B29C33/02 主分类号 C08J7/00
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