发明名称 PRINTED CIRCUIT BOARD POLISHING METHOD
摘要 PROBLEM TO BE SOLVED: To polish a printed circuit board effectively. SOLUTION: A bulged part of an ink put in a hole formed in a printed circuit board (work) W is polished by a rotary polishing tool 20 while the printed circuit board W is being transported, wherein the board transporting speed Vp should range between 1 and 5 m/min, and the ratio Vf/Vp is made 300-800, where Vf represents the peripheral velocity of the polishing tool 20 in rotating and ranges between 1000 and 1200 m/min.
申请公布号 JP2000190197(A) 申请公布日期 2000.07.11
申请号 JP19980371039 申请日期 1998.12.25
申请人 NIPPON COATED ABUREESHIBU KK 发明人 SUDA SHIGEO
分类号 B24B7/06;B24B29/02;H05K3/22;H05K3/26;(IPC1-7):B24B29/02 主分类号 B24B7/06
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