POLYARYLENE SULFIDE RESIN COMPOSITION FOR ELECTRONIC PART ENCAPSULATION

摘要

A polyarylene sulfide resin composition for electronic part encapsulation which comprises: 100 parts by weight of a base composition comprising 20 to 35 wt.% polyarylene sulfide resin (A), 60 to 75 wt.% silica (B), and 1 to 10 wt.% elastomer (C); and 0.05 to 1.2 parts by weight of an epoxy silane (D) and/or 0.1 to 3 parts by weight of an epoxy resin (E). The PAS resin composition is excellent in resistance to moist heat and thermal shock and in flowability while retaining the satisfactory properties inherent in the PAS resin itself. It is suitable for use as an encapsulation material for electronic parts, and neither deforms bonding wires, etc. nor causes package breakage.