Heat sink for electronic control device has power component thermally coupled to heat sink block on underside of component carrier via heat conduction plate in component reception opening in component carrier

摘要

The heat sink has a heat sink block (2) attached to the underside of a component carrier (1) supporting at least one power component (3) which generates waste heat, fitting into an opening (8) in the component carrier, for thermally contacting the heat sink block, via an electrically-insulating heat conduction plate (4), to which the power component is soldered.