| 摘要 |
A device and method for processing substrates, especially semiconductor wafers, whereby a substrate holder containing a substrate is placed in a processing position above a first processing unit, first processing of the substrate occurs and the substrate holder is raised after said first processing. The invention enables further processing of the substrate to occur in a simple manner requiring little space, whereby the second processing unit moves between the raised substrate holder and the first processing unit and second processing of the substrate is carried out.
|
