ULTRASONIC VIBRATION BONDING MACHINE

摘要

An ultrasonic vibration bonding machine which can simplify a suction passage structure. A resonator has a suction passage at the maximum vibration amplitude point where a bonding working portion is provided, the positions of the pads of a circuit board mounted on a mounting unit and the positions of the pads of a semiconductor chip absorbed and adsorbed to the bonding working portion are measured to align the pads accurately, and then the pads are bonded together.