Making electrically conducting adhesive connection between module and electronic component e.g. for chip card, involves first introducing conducting body arranged in compressible fixing structure between them

摘要

The method involves first introducing conducting bodies between the connection contacts and then pressing the module, conducting body and component together. The conducting body (16,17) is arranged in a compressible fixing structure (10) for introduction between the module (25) and the electronic component (26). An Independent claim is also included for a chip card produced with the method.