Power semiconductor casing for surface securing enclosing substrate top and bottom faces, with top face carrying power semiconductor chip

摘要

Top substrate face encloses periphery of two side edges, front and rear edge, and locates power semiconductor chip with bottom and top surface which is metallized. There are numerous terminal pads on the second side edge of the substrate. Numerous contact wires extend from the metallized surface to the terminal pads. Contact wires are each of specified lengths and are arranged next to each other, with adjacent wires of different lengths. Preferably. the substrate has numerous through bores between the top and bottom faces.