发明名称 VERTICALLY INTEGRATED SEMICONDUCTOR ARRANGEMENT
摘要 The invention relates to a vertically integrated semiconductor arrangement with a first semiconductor chip and at least a second semiconductor chip which are arranged on top of each other. At least one semiconductor chip is provided with an integrated circuit and at least one semiconductor chip is embodied as a passive component.
申请公布号 WO0039853(A1) 申请公布日期 2000.07.06
申请号 WO1999DE04032 申请日期 1999.12.20
申请人 INFINEON TECHNOLOGIES AG;PAPADOPOULOS, CONSTANTIN 发明人 PAPADOPOULOS, CONSTANTIN
分类号 H01F17/00;H01L23/64;H01L25/065;H01L25/18 主分类号 H01F17/00
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