| 摘要 |
PURPOSE: A method for forming electrodes is provided to prevent undercut from occurring while preventing hillock and junction spiking due to first metal layer. CONSTITUTION: A method for forming electrodes includes first thru fifth steps. At the first step, a first and second metal layers(23,25) are formed on a substrate. At the second step, a photoresist pattern(27) is formed on a predetermined region of the metal layer. At the third step, the first metal layer(23) is etched so as the second metal layer(25) to be exposed using high concentration H3PO4O+HNO3+CH3COOH+H2O composite solution. At the forth step, the exposed portion of the second metal layer is etched with low concentration H3PO4O+HNO3+CH3COOH+H2O composite solution using the photoresist pattern as a mask. At the fifth step, the photoresist is removed.
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