| 摘要 |
PURPOSE: A semiconductor package and a lead frame used therefor are provided to reduce defects occurred in the package due to eject pins during a molding process. CONSTITUTION: A semiconductor package(200) includes a semiconductor chip(110) embedded in a mold body(170). The chip(110) is mounted onto a die pad(160) of a lead frame and electrically connected with leads(190) of the lead frame. While the die pad(160) and inner portions(130) of the leads(190) are also embedded in the mold body(170), outer portions(140) of the leads(190) are protruded from the mold body(170). In particular, the die pad(160) includes holes(165) centrally formed therein. The holes(165) corresponding to pin holes(180) under the mold body(170) are filled with molding resin to form the mold body(170). Therefore, though the eject pins are inserted into the pin holes(180) and then apply a pressure to the mold body(170), the die pad(160) is not directly affected by a mechanical force of the eject pins.
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