| 摘要 |
PURPOSE: A fabrication equipment of a semiconductor is provided in order that a touch between a transferring unit and an edge of a door or a hole, may not occur, when the transferring unit of a semiconductor wafer moves through the hole. CONSTITUTION: A fabrication equipment of semiconductor is achieved, especially regarding to a structure having the semiconductor wafer move, by increasing sufficiently a size of the door between load-lock chamber and a processor chamber, or the hole in a processor chamber.
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