发明名称 |
Apparatus and method for contacting a sensor conductive layer |
摘要 |
<p>A structure and method is disclosed for grounding an electrostatic discharge device of an integrated circuit to dissipate electrostatic charges comprising an underlying dielectric layer disposed over capacitor plates of sensor circuitry and a conductive layer disposed over the underlying dielectric layer, wherein the conductive layer diffuses electrostatic charges at the surface of the integrated circuit to ground. The conductive material not only dissipates electrostatic charges to the ground, but may also protect at least a portion of the edge of the sensor chip from mechanical stress. <IMAGE></p> |
申请公布号 |
EP1017009(A2) |
申请公布日期 |
2000.07.05 |
申请号 |
EP19990310531 |
申请日期 |
1999.12.23 |
申请人 |
STMICROELECTRONICS, INC. |
发明人 |
LEPERT, ARNAUD YVES;THOMAS, DANIELLE A.;DO-BENTO-VIEIRA, ANTONIO |
分类号 |
H01L27/04;A61B5/117;G01B7/28;G01B7/34;G06K9/00;G06T1/00;H01L21/822;(IPC1-7):G06K9/00 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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