发明名称 |
APPARATUS FOR REMOVING FOREIGN PARTICLE IN SEMICONDUCTOR TCP EQUIPMENT |
摘要 |
PURPOSE: An apparatus for removing a foreign particle in a semiconductor tape carrier package(TCP) equipment is to remove a movable foreign particle attached to the TCP tape, thereby preventing the generation of a short failure. CONSTITUTION: An apparatus for removing a foreign particle in a semiconductor TCP equipment comprises a load part(100) at which a reel(130) around which a space tape(110) and a TCP tape(120) for an inner lead bonding are wound is installed; a main body part(200) into which the TCP tape is transferred and at which the inner lead bonding is performed; an unload part(300) for winding the TCP tape which the inner lead bonding process is completed in the main body part; a foreign particle removing part disposed at a moving path of the TCP tape, for removing foreign particles attached to the TCP tape; and a metal net disposed below the load part and the unload part, for passing through the foreign particle.
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申请公布号 |
KR20000040427(A) |
申请公布日期 |
2000.07.05 |
申请号 |
KR19980056060 |
申请日期 |
1998.12.18 |
申请人 |
HYUNDAI MICRO ELECTRONICS CO., LTD. |
发明人 |
KIM, JIN GU;JANG, HYEON SEONG |
分类号 |
H01L21/60;H01L21/50;H01L51/00;(IPC1-7):H01L21/50 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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