发明名称 APPARATUS FOR REMOVING FOREIGN PARTICLE IN SEMICONDUCTOR TCP EQUIPMENT
摘要 PURPOSE: An apparatus for removing a foreign particle in a semiconductor tape carrier package(TCP) equipment is to remove a movable foreign particle attached to the TCP tape, thereby preventing the generation of a short failure. CONSTITUTION: An apparatus for removing a foreign particle in a semiconductor TCP equipment comprises a load part(100) at which a reel(130) around which a space tape(110) and a TCP tape(120) for an inner lead bonding are wound is installed; a main body part(200) into which the TCP tape is transferred and at which the inner lead bonding is performed; an unload part(300) for winding the TCP tape which the inner lead bonding process is completed in the main body part; a foreign particle removing part disposed at a moving path of the TCP tape, for removing foreign particles attached to the TCP tape; and a metal net disposed below the load part and the unload part, for passing through the foreign particle.
申请公布号 KR20000040427(A) 申请公布日期 2000.07.05
申请号 KR19980056060 申请日期 1998.12.18
申请人 HYUNDAI MICRO ELECTRONICS CO., LTD. 发明人 KIM, JIN GU;JANG, HYEON SEONG
分类号 H01L21/60;H01L21/50;H01L51/00;(IPC1-7):H01L21/50 主分类号 H01L21/60
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