| 摘要 |
PURPOSE: A rinsing apparatus for a semiconductor wafer is provided to prevent the wafer from being contaminated by impurities adhered due to surface tension of rinse solution. CONSTITUTION: In a rinsing apparatus, a wafer to be rinsed is transferred into a rinsing bath(101). The rinsing bath(101) is filled with a rinse solution composed of chemical and deionized water, and so impurities adhered on the wafer are rinsed. The rinsed wafer is then transferred into washing baths(102) by a transfer arm. The washing baths(102) are filled with deionized water to clean the rinse solution. Each washing bath(102) includes injection nozzles(104) for reducing surface tension of the deionized water. The injection nozzle(104) sprays mixed gas containing nitrogen gas and isoproply alcohol vapor. Since the isoproply alcohol vapor has hydrophile property, surface tension on the deionized water becomes weaker. Next, the washed wafer is transferred into a drying bath(103) and then dried.
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