发明名称 Surface acoustic wave device and package for surface acoustic wave element
摘要 <p>A surface acoustic wave element comprising a surface acoustic wave absorbing member is mounted on a support base by use of FDB method to obtain a surface acoustic wave device of smaller size and excellent frequency characteristics. In a surface acoustic wave device of the present invention, in an area facing a surface acoustic wave absorbing member on a die-attach surface of a support base, a concave is disposed. On such a die-attach surface of a support base, a surface acoustic wave element is disposed face-down to mount, and a surface acoustic wave absorbing member is embedded, in the absence of contact, in a concave 9 of a support base 2. A bonding pad of a surface acoustic wave element and a signal terminal of a support base are connected through Au bump. &lt;IMAGE&gt;</p>
申请公布号 EP1017168(A2) 申请公布日期 2000.07.05
申请号 EP19990125996 申请日期 1999.12.28
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KAWAGUCHI, KYOKO
分类号 H03H9/145;H03H9/05;H03H9/25;(IPC1-7):H03H9/05 主分类号 H03H9/145
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