| 摘要 |
PURPOSE: A high heat-conductive epoxy resin composition is provided which is excellent in thermal transpiration and can be used for sealing semiconductor device. CONSTITUTION: An epoxy resin composition comprises 3.0-7.0 wt% (based on the total amount) of an epoxy resin comprising o-cresol novolak epoxy resin and vinylphenyl epoxy resin, 2.0-6.0 wt% (based on the total amount) of a curing agent comprising phenol novolak resin and xylok resin, 0.05-1.0 wt% (based on the total amount) of at least one curing accelerator selected from the group consisting of a tertiary amine, an imidazol, an organic phosphine, and etc., 0.3-1.2 wt% (based on the total amount) of a modifier such as silicon oil having epoxy functional group, or amine functional group, or carboxyl functional group, 70-90 vol% (based on the total amount) of an inorganic filler having 10-40 vol% (based on the total amount) of aluminium nitride, wherein the aluminium nitride has an average particle size of 15-25 micrometer, covered with molten silica. |
