发明名称 STRUCTURE FOR GROUNDING OF HEAD DRUM APPARATUS
摘要 PURPOSE: A grounding structure of head drum apparatus is provided to reduce a producing cost and to improve a working efficiency by simplifying a composition for grounding and reducing a number of processes and to improve a grounding function by appropriately doing a tension of a grounding member in a using for a long time. CONSTITUTION: In a grounding structure of head drum apparatus, a plate-shaped grounding piece(70) formed at least one grounding portions having a wing shape in a fixing shaft(2A) between a upper bearing(7A) and a boss(42A) is installed. A ring portion of the plate-shaped grounding piece(70) is compressed with a certain force by a circular pressing portion of the boss(42A). An end of the wing-shaped grounding portion formed in a girth of the ring portion is maintained a state contacted an embossing projection on a upper face of an outer wheel of a bearing with a certain tension. Thereby a static electricity generated from a upper drum(1A) is removed effectively. And the grounding operation is improved by minimizing a rubbing resistance because the embossing projection formed in the wing-shaped grounding portion is contacted on the upper face of the outer wheel of the bearing(6A).
申请公布号 KR20000038652(A) 申请公布日期 2000.07.05
申请号 KR19980053717 申请日期 1998.12.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, DO YEONG;CHO, YEONG HO;CHOI, HYEONG SEOK;BAEK, CHUNG HEUM;KIM, JUNG YEONG;LEE, SEUNG U;HONG, SEONG HEE
分类号 G11B5/11;(IPC1-7):G11B5/11 主分类号 G11B5/11
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