PAD STRUCTURE OF SEMICONDUCTOR CHIP

摘要

PURPOSE: A pad structure of a semiconductor chip is provided to grind a layer-insulating layer well by making the thickness of the layer-insulating layer over metal of the chip and pad region even. CONSTITUTION: A pad structure of a semiconductor chip comprises depositing a metal layer(10) and a layer-insulating layer(20) one after another to connect the chip and the outer device electrically. Each metal layer is connected through a conductive material filled in via holes(20a) of the layer-insulating layers(20). Many via holes(10a) are formed in one or more metal layers(10). It is preferable that the via holes(10a) are not formed in the uppermost metal layer(10-4).