WARPAGE PREVENTIVE MOLD DIE

摘要

PURPOSE: A warpage preventive mold die is to decrease stress due to the amount of the molding compound for the packaging of semiconductor chips, thereby preventing warpage of packages. CONSTITUTION: A warpage preventive mold die(10) comprises a blocking wall(12) for dividing a plurality of unit packaging regions into plural small groups each having plural unit packaging regions. The blocking wall is disposed between cavities of the mold die. A semiconductor chip(41) is attached by an adhesive(42) at a unit package region(44) of a substrate(40). A conductive wire(43) electrically connects the semiconductor chip with the substrate. A solder ball(47) is coupled to a rear surface of the substrate and is electrically connected with terminals formed on the front surface of the substrate. The cavities are filled with a sealant.