| 摘要 |
<p>A heat sink including a pedestal. The heat sink is used to dissipate heat from an electrical component such as a processor (e.g., a Pentium(R) Pro processor). The pedestal is arranged on the heat sink such that a gap which is formed between a surface of the electrical component and the heat sink is maintained to be less than an acceptable gap size. The gap between the heat sink and the electrical component can occur, for example, due to excessive warping of a surface of the electrical component. The excessive warping can be caused, for example, from manufacturing process problems or thermal changes. The pedestal can be arranged on an end of the heat sink facing the electrical component in a manner advantageous to cover a maximum surface area of the electrical component caused due to a particular size and shape of warping which uniquely occurs on a particular type of electrical component. For example, the pedestal may be arranged in a center portion of the end of the heat sink facing the electrical component.</p> |
