| 摘要 |
PURPOSE: A drying apparatus of a semiconductor wafer and a drying method thereof are provided to remove moisture completely and to reduce drying time. CONSTITUTION: A drying apparatus comprises a motor, a vacuum chuck(12), a chuck heater(13) provided inside the vacuum chuck(12), a supplying duct(14) ejecting IPA gas, a reservoir(15) storing IPA solution and gas, and a heater(16) placing outside of the reservoir(15) to heat the IPA solution. A drying method comprises rotating a wafer(W) by a motor, evaporating IPA solution, stopping the motor, heating the wafer(W), and ejecting IPA gas on the wafer(W).
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