| 摘要 |
PURPOSE: An epoxy resin composition having low elasticity, high adhesiveness, a good solder crack resistance and moldability is provided which prevents contaminants of mold and lowering of fluidity by using methyl trimethoxysilane. CONSTITUTION: A resin composition comprises 3.5-15 weight % of epoxy resin comprising o-cresol novolac, dicyclopentadiene and biphenyl epoxy, 2.0-10 weight % of curing agent such as phenol-novolac resin, cresol-novolac resin or dicyclopentadiene, 0.1-0.3 weight % of curing accelerator such as benzyl dimethyl amine, triethanol amine, triethylene diamine, dimethyl aminoethanol, tri(dimethyl aminomethyl)phenol, imidazoles, organic phosphines or tetraphenyl boron salt, 0.1-1.0 weight % of amine-modified silicone oil, 0.1-0.5 weight % of methyl trimethoxysilane and 80-85 weight % of inorganic filler such as synthetic silica. |
