MANUFACTURE METHOD OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A manufacturing method of a semiconductor package is provided to secure co-planarity of solder balls as external terminals of the package. CONSTITUTION: A semiconductor package(10) includes encapsulant formed on a circuit board(20) and containing a semiconductor chip therein. The semiconductor chip is electrically connected with solder balls(30) under the circuit board(20) through circuit patterns of the circuit board(20). When the package(10) is subjected to a process for mounting the solder balls(30), an undesirable warpage happens to the package(10) due to differences in thermal expansion between different materials. The solder balls(30) are therefore formed along a bending bottom plane of the circuit board(20). To attach the package(10) onto a mother board, the solder balls(30) should be co-planar. Accordingly, the solder balls(30) are then cut along a base line(70) corresponding to the mother board. Next, applying heat to the cut solder balls(30), the solder balls(30) are again formed into ball-shape.