BGA DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A ball grid array(BGA) package is provided to decrease a thickness of the package, to simplify a manufacture process, and to improve heat dissipation. CONSTITUTION: A plurality of BGA packages are made on a wafer(21). The wafer(21) includes a plurality of semiconductor devices formed therein and a plurality of chip pads(23) formed thereon. A back of the wafer(21) is lapped by a grinder to thin the wafer(21). Next, while a circuit substrate(27) is adhered to a front of the wafer(21) by an adhesive(29), a backing plate(31) is adhered to the back of the wafer(21) by another adhesive(33). The circuit substrate(27) includes contact pads thereon, each of which is correspondingly faced and joined to each chip pad(23). Moreover, the backing plate(31) as a heat-dissipating medium includes a plurality of slits corresponding to scribe lines of the wafer(21). A plurality of solder balls(37) are then mounted on ball pads of the circuit substrate(27), the ball pads being respectively connected with the contact pads. The wafer(21) and the circuit substrate(27) are finally cut along the slits of the backing plate(31), so that the individual BGA packages are obtained.