MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A manufacturing method of semiconductor packages is provided to prevent damage of a plating layer on outer leads. CONSTITUTION: In a manufacturing method of semiconductor packages(20), a process of forming outer leads(15) into a proper form precedes a process of plating the outer leads(15) not to cause damage to a plating layer(27) on the outer leads(15). A semiconductor chip is embedded in a package body(26) and electrically connected with the outer leads(15) through bonding wires and inner leads. In the forming process, a connection bar(16) is separated from a frame(18) at its end(16a), and the outer leads(15) are then transformed into a form suitable for mounting onto an external electronic device. However, the outer leads(15) are electrically connected with the frame(18) through a zigzag bar(24) linked with the connection bar(16). Since electric power is supplied to the outer leads(15) through the zigzag bar(24), the plating process can be performed after the forming process and the plating layer(27) is free from damage in the forming process.