发明名称 |
APPARATUS FOR CUTTING PROCESSED GLASS FORMED WITH A PATTERN |
摘要 |
PURPOSE: An apparatus for cutting processed glass is provided to prevent the pattern of the processed glass from being damaged and enhance the processing quality by discriminating lasers to be used for cutting the processed glass. CONSTITUTION: Processed glass(10) with a pattern(P) is provided. An Nd-YAG laser(21) cuts a portion of the pattern(P) on the processed glass(10). A CO2 laser(22) applies heat on a pattern-removed portion of the processed glass(10) in a non-contact manner to cut the processed glass(10). the pattern of the processed glass(10) is removed the Nd-YAG laser(21). A cooler(23) jets a coolant to the processed glass(10) heated by the CO2 laser(22) to abruptly cool the processed glass(10) in order for the processed glass(10) to be cut.
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申请公布号 |
KR20000040563(A) |
申请公布日期 |
2000.07.05 |
申请号 |
KR19980056224 |
申请日期 |
1998.12.18 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
KANG, HYUNG SIK;CHOI, JONG YUN |
分类号 |
C03B21/00;(IPC1-7):C03B21/00 |
主分类号 |
C03B21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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