MULTI-LAYERED PCB INTERCONNECTED TO EACH OTHER WITHOUT PUNCH PROCESS AND FABRICATION METHOD THEREOF

摘要

PURPOSE: A multi-layered PCB and fabrication method thereof is to electrically connect multi-layered PCBs to each other without forming through holes for interconnection at the PCBs, thereby simplifying the fabrication process. CONSTITUTION: A fabrication method of a multi-layered PCB comprises the steps of: forming on a first mandrel a first conductive circuit(6) having a plurality of lands for the connection between layers of the PCB; placing a conductive solder material(7) on the lands; heating the conductive solder material to be fused; placing a second conductive circuit formed on a second mandrel and having a plurality of lands over the first conductive circuit; aligning the second conductive circuit with the first conductive circuit; heating the solder material to bond the solder material to the second conductive circuit; and filling a coaxial spacer(12) between the first conductive circuit and the second conductive circuit.