DEVICE FOR END POINT DETECTION OF WET ETCHING ON SEMICONDUCTOR SUBSTRATE

摘要

PURPOSE: A device for end point detection of wet etching on semiconductor substrate is provided to easily detect etching end point when an actuator pattern of acceleration sensor is made. CONSTITUTION: A semiconductor substrate is installed on a jig(20). The jig(20) comprises a first jig(21) and a second jig(22). An O-ring(23a) in the first jig(21) is contiguous to the outside of semiconductor substrate and keeps sealing with the semiconductor substrate. After combining the semiconductor between the first jig(21) and the second jig(22), a tube(24) connected with a penetration groove(21a) in the first jig(21) draws designated pressure to improve close adhesion. The substrate is soaked in etching solution and etched to make an actuator pattern of semiconductor acceleration sensor. After creating the actuator pattern, the etching solution runs to a flow detection sensor(40) through the penetration groove(21a) in the first jig(21). An etching end point can be judged by dealing with dealing with a result of the flow detection sensor(40) using external circuit.