METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for manufacturing a printed circuit board capable of maximizing a performance of the printed circuit board by removing a part which is irrelevant to a function of the printed circuit board is provided. CONSTITUTION: In a method for manufacturing a printed circuit board, a plurality of layers each having a circuit pattern are stacked. The plurality of stacked layers are electrically connected to one another. first and second circuit patterns, pads, and tie bars are formed at upper and lower surfaces of each of the stacked layers to form an outer layer. A solder resist is laminated on the outer layer to selectively remove the pad and tie bar. A photo sensitive material is coated on the pad and tie bar to form a pad and tie bar coating layers. The pad coating layer is selectively removed and a gold is plated to the pad. The tie bar coating layer is selectively removed and the tie bar is removed.