| 摘要 |
PURPOSE: A multi chip package is provided to have a stable structure of electrical connection or chip arrangement and to decrease a thickness and a size of the package. CONSTITUTION: A multi chip package(10) includes two chips(11,13) and a substrate(22) having a stepped window(29) centrally formed therein. The first chip(11) having bonding pads(12) centrally formed thereon is attached under the substrate(22) by an adhesive(31) so that the pads(12) are exposed through the window(29). The second chip(13) having bonding pads(14) peripherally formed thereon is attached back to back with the first chip(11) by an adhesive(32). While some circuit wirings(23a) of the substrate(22) are exposed to a horizontal plane(25) in the stepped window(29), the others(23b) are exposed to a bottom of the substrate(22). The pads(12) on the first chip(11) are electrically connected with the circuit wirings(23a) within the stepped window(29) by bonding wires(33a), and the pads(14) on the second chip(13) are electrically connected with the circuit wirings(23b). Solder balls(35) are formed on a top of the substrate(22) and electrically connected with the circuit wirings(23a,23b). An encapsulant(37a) fills the window(29) and another encapsulant(37b) seals up the chips(11,13).
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