CUTTING APPARATUS FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE: A cutting apparatus is provided to separate semiconductor integrated circuit devices from a tape circuit substrate at one time. CONSTITUTION: A cutting apparatus(100) includes a punching die(60) for supporting a tape circuit substrate(80) and punches(70) for cutting the tape circuit substrate(80). The tape circuit substrate(80) includes a plurality of semiconductor integrated circuit(IC) devices(87) formed thereon. The punching die(60) includes punching blocks(62) each of which corresponds to the IC device(87) and is formed on a top surface(68) of the die(60). Each punching block(62) supports a bottom of the IC device(87), whereas a recess portion(64) centrally formed in the block(62) receives solder balls formed under the IC device(87). The punching die(60) further includes index pins(66) to be inserted into holes(89) of the tape circuit substrate(80). Each punch(70) corresponding to the punching block(62) includes a punch body and a fixing rod. While the punch body has an internal rectangular hole wider than the IC device(87), the fixing rod is located in the internal hole. When the IC devices(87) are supported by the punching blocks(62) and the fixing rods press down the IC devices(87), the punch bodies go down and cut the tape circuit substrate(80). Therefore, the IC devices(87) are separated from the tape circuit substrate(80).